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 Stutensee (Germany) — MSC presents the U10 Multi-band WCDMA / GSM module from Quectel at embedded world 2012, Nuremberg in Hall 2, Booth 2-219 from February 28 to March 1, 2012. The U10 features a High Speed Downlink Packet Access (HSDPA) of 7.2 Mbps and a High Speed Uplink Packet Access (HSUPA) of 5.76 Mbps.The module, which was designed for use in HSPA, GPRS and EDGE modems and portable multimedia applications, has dimensions of only 37.7 mm x 29.9 mm x 5 mm and is based on the new MT6276 communications controller that is equipped with a 32-bit ARM1176 RISC processor.
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 Farnell, has enhanced its range of interconnect products by becoming the first European distributor to offer small quantities of RF Coaxial connectors from Molex for prototype and pre-production build applications. The Molex product ranges now offered by Farnell include: BMA, BNC, MCX, Mini BNC, MMCX, QMA, SMA, SMB, SMP, SSMCX, TNC, and N Type products.
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 The range of TME’s products has been extended with new cable accessories of a German LAPPKABEL company. TME’s offer includes gland inserts, thread reduction and ATEX certified glands. Those glands can be used, among others, in places with a risk of explosion. The introduced thread reductions are available in three versions, dividing reductions, PG thread reduction into a metric thread and from metric thread into PG thread.
www.tme.eu
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 SemiSouth Laboratories, Inc., the leading manufacturer of silicon carbide (SiC) transistor technology for high-power, high-efficiency, harsh-environment power management and conversion applications, has announced a demo board showing the operation of its SiC JFETs in a cascode half-bridge configuration.
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 NXP Semiconductors (NASDAQ: NXPI) announced a major new benchmark in miniaturization with the launch of its next-generation family of low VF Schottky rectifiers targeting the mobile device market. With a typical thickness of just 0.37 mm and an outline of 1.6 x 0.8 mm, the new DFN1608D-2 (SOD1608) plastic package is the smallest on the market that is capable of carrying a current of up to 1.5A.
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 Nuremberg, 8-10 May 2012
Main topics
- Production Line „Future Packaging“- joint booth will offer technology consulting on different topics.
- The theme park “Power Electronics and Manufacturing for E-Mobility“- presentation platform will focus on the solutions, applications and trends in the field of E-Mobility.
- Joint stand of the Research Association 3D-MID e.V. - an insight into the Molded Interconnect Devices technology.
- Service Point EMS
- Joint stand “Optics meets Electronics”
More informations here.
www.mesago.de
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 Poing/Munich: EBV Elektronik, an Avnet (NYSE:AVT) company and EMEA’s leading specialist in semiconductor distribution, has released its third annual ECOmise it™ Report. In this document, environmental activities and measures implemented during Avnet’s fiscal year 2011 are detailed and future goals set.
www.ebv.com
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 Are you looking for a unique system for identifying your PCBs and electronic devices that is fast, copy-proof, reliable and virtually indestructible? Are you tired of fighting with illegible EAN codes, ripped-off labels, and product piracy? Then we have the right solution for you: MAGIC-PCB® The RFID PCB identification system. A consortium composed of Murata, Kathrein, Alpha-board and Beta LAYOUT is implementing something you may have wanted for a long time: putting RFID to work in the early phases of the product development process.
www.pcb-pool.com/ppuk/, www.murata.com/products/rfid
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 element14, the first global electronics community and a business of Premier Farnell (LSE:pfl), announced that “The Ben Heck Show” has attracted more than three million views since its launch. The popular online television show, exclusively sponsored by element14, first aired in September 2010 at www.element14.com/tbhs and features American modding guru Benjamin J. Heckendorn, known familiarly as Ben Heck.
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 Ispringen (Germany) – The new Power Topled with lens (SFH 4258S/4259S) from OSRAM Opto Semiconductors has an 80 percent higher optical output than the standard version of the infrared LED – despite the same surface area and the same current. This boost comes from a special thin-film chip which, thanks to Nanostack technology, has not just one but two p-n junctions that are grown one on top of the other. The resultant increased range will above all benefit applications in the security sector and in gesture recognition. The new Power Topled is now available at distributor Rutronik.
www.rutronik.com
More informations here.
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 Planegg / Germany – Maxim Integrated Products Inc. (NASDAQ: MXIM) introduces the MAX16919/MAX16969, High-Speed USB 2.0 automotive-grade protectors with iPod®/iPhone® fast-charge detection and USB host-charger detection for all USB gadgets. The protectors’ fast-charge detection supports both High-Speed USB (480Mbps) and full-speed USB (12Mbps) operation, which conveniently lets consumers recharge their USB devices while driving.
www.maxim-ic.com/company/newsroom
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