Nuremberg, 8-10 May 2012

Main topics

• Production Line „Future Packaging“- joint booth will offer technology consulting on different topics.
• The theme park “Power Electronics and Manufacturing for E-Mobility“- presentation platform will focus on the solutions, applications and trends in the field of E-Mobility.
• Joint stand of the Research Association 3D-MID e.V. - an insight into the Molded Interconnect Devices technology.
• Service Point EMS
• Joint stand “Optics meets Electronics”

More informations here.

www.mesago.de