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NXP Delivers Breakthrough 0.37-mm Ultra-Flat Package with Schottky Rectifiers up to 1.5A

nxp-schottkyNXP Semiconductors (NASDAQ: NXPI) announced a major new benchmark in miniaturization with the launch of its next-generation family of low VF Schottky rectifiers targeting the mobile device market. With a typical thickness of just 0.37 mm and an outline of 1.6 x 0.8 mm, the new DFN1608D-2 (SOD1608) plastic package is the smallest on the market that is capable of carrying a current of up to 1.5A.

The DFN1608D-2 has been released with a portfolio of six Schottky Barrier rectifiers: three 20V types optimized for very low forward voltage and three 40V types optimized for very low reverse current. Average forward current ranges between 0.5 and 1.5A.

www.nxp.com/news/press-releases

 

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