česky english Vítejte, dnes je pátek 20. červenec 2018

Webináře živě

Eliminate Hidden Costs in IoT Device Test

Keysight Technologies

This webinar will describe the various approaches for IoT device test including golden radio, paired devices, parametric testers, and the Keysight X8711A IoT device functional tester, to help you decide on the right approach for your situation.

Datum: 17. 7. 2018 - 19:00 SELČ
Date: July 17, 2018 - 1:00 PM ET | 10:00 AM PT | 7:00 CEST

 

Additive Manufacturing and Lightweight Materials for Aerospace and Defense: Part I

IDTechEx

Part I of the "Additive Manufacturing and Lightweight Materials for Aerospace and Defense" webinar series includes:

  • Insight into technology adoption drivers and restraints
  • An overview of the key additive manufacturing for lightweighting technologies and materials
  • Insight into the additive manufacturing strategies developed by OEMs

Datum: 19. 7. 2018 - 3:00 SELČ | 11:00 SELČ | 18:00 SELČ (45 minut)
Date: July 19, 2018 - 3:00am CEST | 11:00am CEST | 6:00pm CEST (45 minutes)
 

IPC Technical Webinar: Systematic Failure Analysis

IPC

The webinar introduces you to professional systematic failure analysis techniques. During the webinar you will be shown typical climatic stress failure patterns based on actual cases. Also, approaches will be reviewed for futures avoidance of failure. 

Datum: 19. 7. 2018 - 14:30 SELČ (60 minut)
Date: July 19, 2018 - 14:30 CEST (60 minutes)

 

Physics of Failure in The Aircraft Development Process

DfR Solutions

Based on a “smart” System Engineering requirements deployment and proper allocation to allow an easy and clear relationship between aircraft high level objectives and equipment reliability targets, Physics of Failure electronics simulation is, without question, one of the most useful and powerful tools to support design trade-off decisions. Challenges and opportunities between these two “isolated” processes are becoming clearer.  We now have a chance to access better design decisions, in a timely fashion, for thermal and vibration aspects along all product value chains, including airframe, systems and equipment/board level.  This improved process reduces development schedules and costs and increases the delivery of a high level of reliability since EIS.

Datum: 19. 7. 2018 - 17:00 SELČ
Date: July 19, 2018 - 11:00 AM EST | 5 PM CEST
 

Advanced Signal Integrity Simulation Techniques

Mentor, a Siemens Business

Signal Integrity simulation and modeling techniques are becoming more and more complex as signal speeds continue to increase.  The 2D models used for lower frequencies are not as accurate when signals exceed 1 GHz. 

In this webinar we will explore advanced simulation and modeling methods being used for these higher speed applications. We will demonstrate how the HyperLynx Signal Integrity software addresses these complex high speed issues while still maintaining the ease-of-use that has always been a characteristic of HyperLynx.  We will explore the 3D via modeling capability that is included with the HyperLynx GHZ option, and how the integration with the Advanced Full-wave Solver option allows for the automatic 3D area extraction and creation of models for other copper structures.

Datum: 19. 7. 2018 - 17:30 SELČ (60 minut)
Date: Jul 19, 2018 - 8:30 AM US/Pacific (60 minutes)

 

Multi-Wireless-SoC for WiFi, Bluetooth and ZigBee

Rutronik

This webinar will provide information about Redpine’s RS1400 and RS9116 ultralow-power Wireless Secure MCUs and wireless connectivity product lines:

Datum: 20. 7. 2018 - 10:00 SELČ (60 minut)
Date: July 20, 2018 - 10:00 AM CEST (60 minutes)

 

A guide through NAND flash

Rutronik

The webinar will highlight ways to select the best NAND flash solution for an application

Datum: 26. 7. 2018 - 10:00 SELČ (30 minut)
Date: July 26, 2018 - 10:00 am CEST (30 minutes)

 

DFMStream/CAM350 Webinar - Improve Product Quality while Saving Time and Costs

DownStream Technologies

A best in class new product introduction process requires a predictable and error free transition from design to manufacturing. Discovering design errors during the manufacturing cycle leads to production delays and unexpected costs. Organizations with a best in class NPI process analyze for potential errors before committing a design to fabrication when there is more time and greater options to address them.

Datum: 31. 7. 2018 - 15:00 SELČ a 20:00 SELČ (60 minut)
Date: July 31, 2018 - 9:00 AM EDT | 6:00 AM PDT | 3:00 PM CEST and 2:00 PM EDT | 11:00 AM PDT (60 minutes)

 

BluePrint-PCB Webinar - Create High Quality Documentation while Saving You Time and Money

DownStream Technologies

A best in class new product introduction process requires a predictable, repeatable and error free exchange of documentation between design and manufacturing. High quality PCB documentation leads to expedited assimilation of a design into manufacturing with fewer questions, fewer errors, and lower overall costs. Organizations that demand high quality PCB Documentation be an integral part of their process realize shortened turn-around times, improved product quality, and overall reduced costs.

Datum: 1. 8. 2018 - 15:00 SELČ a 20:00 SELČ (90 minut)
Date: August 1, 2018 - 9:00 AM EDT | 6:00 AM PDT | 3:00 PM CEST and 2:00 PM EDT | 11:00 AM PDT (90 minutes)

 

High Speed Routing Techniques in PADS Professional

Mentor, a Siemens Business

PCB designs are becoming increasingly more dense and complex, and also more strictly constrained to design rules.  This has made it more difficult to place and route these designs quickly and efficiently.

In this webinar we will provide an overview of the PADS® Professional routing environment and demonstrate how it combines ease-of-use with highly automated functionality to give engineers exceptional control over the creation of the most complex designs.  We will highlight the Sketch Router technology that combines automatic routing power with user control during interactive editing operations, producing high-quality results with exceptional performance.

Datum: 2. 8. 2018 - 17:30 SELČ (60minut)
Date: Aug 2, 2018 - 11:30 AM US/Eastern (60 minutes)

 

Industry 4.0 = Design Verification Webinar

Mentor, a Siemens Business

IoT, Digital Twin, Industry 4.0 are all terms being used today in our new age of product design.  Either you’re a single engineer or part of a team designing the next great thing. You’re being asked to do more in less time. To ensure your design works the first time more engineers are incorporating simulation into the design process. 

To be a part of this new generation of engineering you need tools that are integrated, easy to use, and that are best in the industry. Whether it’s analog, signal integrity, FPGA, or thermal all these tools can be part of an integrated design flow. During this webinar we’ll give you an introduction to how you can streamline your design flow to be part of the Digital Twin era.

Datum: 9. 8. 2018 - 17:30 SELČ (60 minut)

Date: Aug 9, 2018 - 8:30 AM US/Pacific (60 minutes)

Modeling the Etching of Nanostructures

COMSOL

In this webinar, Derek will show how he uses diffusion and surface reactions to describe the etching of a solid material. He will show the modeling process live in the COMSOL Multiphysics® software as well as discuss how to take into account the change in shape of the simulation domain. Simulation results will be investigated, including the uniformity of etching adjacent structures, how long it takes for the material to be etched, the depth of the resulting trench and its effect on reactants' diffusion, and the influence of different process conditions.

Datum: 9. 8. 2018 - 19:00 SELČ (60 minut)
Date: August 9, 2018 - 14:00 ET | 11:00 PT | 18:00 GMT (60 minutes)

 

HyperLynx Multi Board Analysis

Mentor, a Siemens Business

See how you can use the power of HyperLynx SI to simulate signals in your multiboard design. HyperLynx SI simplifies the process of simulating signals driven from one board to another. The MultiBoard Wizard allows for multiple boards to be easily imported and connections defined.

Datum: 16. 8. 2018 - 17:30 SELČ (60minut)
Date: Aug 16, 2018 - 8:30 AM US/Pacific (60 minutes)

Partneři

eipc
epci
imaps
papouch
ep
mikrozone
mcu
projectik