In this webinar, the Analysts will present an:
Datum: 16. 10. 2018 - 3:00 | 11:00 | 18:00 SELČ (50 minut)
Date: October 16, 2018 - 3:00am | 11:00am | 6:00pm CEST (50 minutes)
This webinar will cover:
Datum: 17. 10. 2018 - 20:00 SELČ
Date: 17th October, 2018 - 19:00 GMT | 13:00 CDT
This webinar will provide:
Datum: 18. 10. 2018 - 3:00 | 11:00 | 18:00 SELČ (30 minut)
Date: October 18, 2018 - 3:00am | 11:00am | 6:00pm CEST (30 minutes)
Join the webinar to learn about design variants and how they are a great technique when needing to produce more than one version of a board. For example, you have a common PCB but need to fit an extra sensor circuit for a high-end version of the product.
Datum: 18. 10. 2018 - 16:30 SELČ (60 minut)
Date: Oct 18, 2018 - 4:30 PM CEST (60 minutes)
The reliability risks associated with commercial-off-the-shelf (COTS) electronics and printed circuit board assemblies (PCBAs) can be challenging to evaluate. The integration of COTS PCBAs into larger systems often results from the need to reduce cost and design timelines. In these cases, there is frequently minimal design information available from the manufacturer. Additionally, COTS assemblies are increasingly utilized in non-commercial environments (i.e. military, aerospace). Dedicated resources and significant testing time can be required to assess these assemblies. This webinar will provide a live demonstration of how a COTS PCBA can be assessed using Sherlock Automated Design Analysis™ software, given only a physical sample and no design information. This approach is a cost-effective way to assess board-level reliability and better understand a PCBA’s response to environmental conditions.
Datum: 18. 10. 2018 - 17:00 SELČ
Date: October 18, 2018 - 11 am EDT | 17:00 CEST
In this webinar, we will discuss RF considerations and then provide you with the essential information you need to know when designing an antenna for IoT devices.
Datum: 18. 10. 2018 - 18:00 SELČ (60 minut)
Date: Oct 18, 2018 - 6:00 PM CEST (60 minutes)
This webinar will include:
Datum: 23. 10. 2018 - 3:00 | 11:00 | 18:00 SELČ (40 minut)
Date: October 23, 2018 - 3:00am | 11:00am | 6:00pm CEST (40 minutes)
With the BLE 5.0 standard new features come into life. This webinar will give a rough overview what the new features mean for the user and how SIG listing can be achieved with pre-certified radio modules.
Datum: 24. 10. 2018 - 15:00 SELČ (60 minut)
Date: October 24, 2018 from 3:00 PM CEST (60 minutes)
Mentor, a Siemens Business
Not sure what is required to setup Databook? Wondering how to perform a multi-criterion search for your parts? Need to add missing properties to components on your schematic? Join our panel of experts on October 24th to get your Databook questions answered.
Databook provides part search and verify capabilities when creating your schematics. It utilizes parametric part data stored in an ODBC-compliant Database Management System database and merges that with the CAD Library schematic symbols. Databook offers parametric search functionality that allows you to easily find the appropriate parts and place them in your design. The verify capability ensures the parts used in your schematic are approved and correct with respect to your parts library. This facilitates smoother transitions to downstream processes such as purchasing.
Datum: 24.10. 2018 18:00 SELČ (30 minut)
Date: October 24, 9:00 AM US/Pacific (30 minutes)
Mentor, a Siemens Business
Simcenter Flomaster V9.1 focuses on increasing user productivity and extending simulation applicability. A number of enhancements are introduced in the user interface and in the Launchpad to help to increase user productivity. In particular, warning and error messages are made more clear and powerful and a black-box component is introduced to protect sensitive data and intellectual property.
Datum: 25. 10. 2018 - 12:00 SELČ | 19:00 SELČ (45 minutes)
Date: 25th October 2018 - 11am UK & 10am PST (45 minutes)
With the larger size of Ball Grid Array (BGA) solder joints, the available volume for underfilling is significantly increased. Although the size of the solder joints and package dimension governs the volume of underfill material, the larger 2nd level solder interconnects are more susceptible to thermal fatigue with certain underfills and thermal profiles.
In this webinar we will discuss a study of BGA packages that were underfilled with two dedicated underfill materials and two soft materials used as conformal coatings and encapsulants in electronic products. We will review the factors associated with reduced fatigue endurance of certain underfill materials under temperature profiles with mean temperature conditions and contribute to the development of new criteria of underfill material selection for 2nd level interconnects.
Datum: 25. 10. 2018 - 17:00 SELČ
Date: October 25, 2018 - 11 am EDT | 17:00 CEST
This vebinar will cover:
Datum: 31. 10. 2018 - 20:00 SEČ
Date: 31st October, 2018 - 19:00 GMT | 13:00 CDT
Mentor, a Siemens Business
PADS 3D gives designers the power to visualize their PCB design in 3D. Importing models for components allows for more accurate 3D collision checking. This webinar will show the correct methodology for importing mechanical models, saving them to your library, and using these models in future designs.
Datum: 8. 11. 2018 17:30 SELČ
Date: November 8, 2018, 8:30 AM US/Pacific
GreenSoft Technology, Inc.
Join us for this free educational webinar to learn about the new EU Medical Device Regulation (EU MDR). Attendees will be given an overview of the regulation requirements for medical device product and parts manufacturers.
- Receive an overview of the EU Medical Device Regulation (EU MDR)
- Learn your responsibilities and requirements as a medical device product or parts manufacturer
- Ensure you’re complying with the updated version of the regulation (formerly EU Medical Device Directive)
Datum: 14. 11. 2018 - 16:00 SELČ
Date: November 14, 2018, 4:00 PM CET (UTC +1) | 10:00am EST (UTC -5)